SEMICONDUCTOR MODULE
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Feb 27, 2013
filing date -
Mar 30, 2012
priority date (Note) -
Abandoned
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Abstract
In the semiconductor module comprising a package substrate, a first semiconductor package, and a semiconductor bare chip, such problems as the occurrence of a wire short caused by warpage of the first semiconductor package and non-filling and the like at the time of resin sealing can be solved.
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