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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
FOXSEMICON INTEGRATED TECHNOLOGY INC	NO 16 KE-JUNG RD SCIENCE-BASED INDUSTRIAL PARK CHU-NAN MIAO-LI HSIEN

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• 2012 Application Filing Year
• H01L Class
• 20465 Applications Filed
• 18077 Patents Issued To-Date
• 88.34 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
CHAO, CHENG-CHAO	Chu-Nan, TW	3	2
# of filed Patents : 3 Total Citations : 2
YANG, SUNG-HSIANG	Chu-Nan, TW	25	275
# of filed Patents : 25 Total Citations : 275
YEH, WEI-CHUN	Chu-Nan, TW	16	141
# of filed Patents : 16 Total Citations : 141

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Patent Citation Ranking

• 2 Citation Count
• H01L Class

• 4.91 % this patent is cited more than
• 12 Age

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Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 3, 2025

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Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2013/0256,734

LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

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Abstract

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An LED (light emitting diode) includes a base, two spaced electrodes and a thermal conductivity layer. The base has a top surface. The two electrodes and the thermal conductivity layer are located on the top surface of the base. The thermal conductivity layer is attached to the top surface and located beside and between the electrodes. The two electrodes are electrically insulated from each other, and electrically insulated from the thermal conductivity layer. A light emitting chip is electrically connected to the two electrodes. The electrodes and the thermal conductivity layer are on different levels.

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Description

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Claims

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