PROCESSING SUBSTRATES USING A TEMPORARY CARRIER
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Jun 3, 2011
filing date -
Jun 4, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.
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