ENHANCED LIFT-OFF TECHNIQUES FOR USE WHEN FABRICATING LIGHT SENSORS INCLUDING DIELECTRIC OPTICAL COATING FILTERS
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Jun 22, 2012
filing date -
Mar 20, 2012
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Abandoned
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Abstract
Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In certain embodiments, a short duration soft bake is performed. Alternatively, or additionally, temperature cycling is performed. Alternatively, or additionally, photolithography is performed using a photomask that includes one or more dummy corners, dummy islands and/or dummy rings. Each of the aforementioned embodiments form and/or increase a number of micro-cracks in the dielectric optical coating not covering the photodetector sensor region, thereby enabling an accelerated lift-off process and an increased process margin. Alternatively, or additionally, a portion of the photomask can include chamfered corners so that the dielectric optical coating includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.
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