Electro-Depositing Metal Layers of Uniform Thickness
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Dec 6, 2011
filing date -
Dec 7, 2010
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Abandoned
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Abstract
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
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