SURFACE CONDUCTIVE MULTILAYERED SHEET
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Oct 6, 2011
filing date -
Oct 7, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A surface conductive thermoplastic resin sheet and a molded member, such as an embossed carrier tape, using the sheet, in which burr- and flash-related faults are prevented, whatever the molding equipment, by a slitting method or punching when embossing. Provided is a conductive multilayered sheet, and an electronic component package, a carrier tape and a tray consisting of the conductive multilayered sheet, wherein respective layers with a mean thickness of 2 to 50 μm are composed of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and wherein a conductive resin layer consisting of 65 to 95 wt % of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and 5 to 35 wt % of carbon black, on one side or both sides of the base sheet consisting of multiple layers wherein 10 to 50 respective layers are layered.
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