METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

13847943

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Abstract

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A semiconductor device comprising a substrate made of a material with a hexagonal crystal structure and having a substrate axis which is perpendicular to a principal surface of the substrate; and a nitride-based group III-V compound semiconductor layer grown directly on and in contact with the principal surface of the substrate without growing a buffer layer between the substrate and the nitride-based group III-V compound semiconductor layer, wherein, a direction of a growth axis of the semiconductor layer is substantially the same as a direction of the substrate axis of the substrate.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO 141-0001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ARIMOCHI, MASAYUKI Kanagawa, JP 9 42
HINO, TOMONORI Tokyo, JP 45 664
OHMAE, AKIRA Kanagawa, JP 28 224
SHIOMI, MICHINORI Kanagawa, JP 29 181
SUZUKI, NOBUHIRO Miyagi, JP 109 2294
TOKUDA, KOTA Kanagawa, JP 51 80
YANASHIMA, KATSUNORI Kanagawa, JP 53 940

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