SEMICONDUCTOR LASER DEVICE

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United States of America Patent

SERIAL NO

13840004

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor laser device comprises a base, a first conductive layer, a second conductive layer, a third conductive layer, and a semiconductor laser chip in this order, each of which has a respective emitting-side end portion. The emitting-side end portion of the first conductive layer is in a common plane with the emitting-side end portion of the base. A thickness of the second conductive layer is greater than a thickness of the first conductive layer. The emitting-side end portion of the second conductive layer is disposed inward of the emitting-end portion of the first conductive layer. The emitting-side end portion of the third conductive layer is in a common plane with the emitting-side end portion of the second conductive layer. The emitting-side end portion of the semiconductor laser chip is disposed outward of the emitting-side end portion of the third conductive layer.

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Patent Owner(s)

Patent OwnerAddress
NICHIA CORPORATIONANAN-SHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIMOTO, Hideyuki Anan-shi, JP 16 69
NAKAGAKI, Masatoshi Komatsushima-shi, JP 19 6

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  • 2 Citation Count
  • H01S Class
  • 3.07 % this patent is cited more than
  • 12 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2031213375342616123631201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +020406080100120140160180200220240260280300320340

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