HEAT SINK PROFILE FOR INTERFACE TO THERMALLY CONDUCTIVE MATERIAL
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Mar 22, 2012
filing date -
Mar 22, 2012
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Abstract
A heat sink employs a scalloped surface profile to facilitate interface to thermally conductive materials. The scalloped surface profile reduces the surface area initially as the thermally conductive material is compressed for assembly. The reduced surface area allows the required compression force to be decreased, which helps reduce the risk of damages to the heat generating devices due to excessive force. The scalloped surface profile increases the final surface area in contact with the thermally conductive material after assembly. The increased final surface area helps improve the transfer capacities of the heat sink.
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