CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Mar 12, 2013
filing date -
Mar 21, 2012
priority date (Note) -
Abandoned
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Abstract
A conductive fine powder includes flat metal/alloy fine particles. The flat metal/alloy fine particles have a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix. The flat metal/alloy fine particles have a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and contain a high-melting-point metal and a low-melting-point metal.
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