METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
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United States of America Patent
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Sep 10, 2013
Grant Date -
Sep 26, 2013
app pub date -
Mar 22, 2012
filing date -
Mar 22, 2012
priority date (Note) -
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Abstract
A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.
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