FILM SUBSTRATE LIQUID CRYSTAL SEALING METHOD

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United States of America Patent

SERIAL NO

13898658

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Abstract

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A film substrate liquid crystal sealing method includes injecting a liquid crystal material between a first substrate and a second substrate via an opening part formed on the first substrate, the second substrate or combination thereof, injecting a sealing material for sealing the liquid crystal material injected in the injecting of the liquid crystal material via the opening part, and hardening the sealing material in a pressed state by pressing down a portion that protrudes from the opening part of the sealing material injected in the injecting of the sealing material toward an inside of the opening part with a pressing member.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU FRONTECH LIMITED1776 YANOKUCHI INAGI-SHI TOKYO 206-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAMADA, Hidenobu Inagi-shi, JP 26 297
KOWATA, Katsukiyo Inagi-shi, JP 1 4

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  • 4 Citation Count
  • G02F Class
  • 2.41 % this patent is cited more than
  • 12 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges25475239116723929143681201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500

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