METHOD FOR PRODUCING EXTRUDED POLYSTYRENE RESIN HEAT-INSULATING FOAM BOARD

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United States of America Patent

APP PUB NO 20130245142A1
SERIAL NO

13789191

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Abstract

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A method for producing an extruded heat-insulating foam board having a thickness of 10 to 150 mm, an apparent density of 20 to 50 kg/m3 and a closed cell content of at least 80% by extrusion foaming of a foamable resin melt containing a base resin composed primarily of a polystyrene resin, a physical blowing agent and a flame retardant, wherein 3 to 50 mol % of a hydrofluoroolefin, 30 to 70 mol % of a saturated hydrocarbon having 3 to 5 carbon atoms, and 5 to 50 mol % of water and/or carbon dioxide (where the sum of the contents of the hydrofluoroolefin, saturated hydrocarbon having 3 to 5 carbon atoms, water and/or carbon dioxide is 100 mol %) are used as the physical blowing agent. The extruded polystyrene resin heat-insulating foam board is produced with good extrusion foamability and moldability and has a high expansion ratio, a large thickness, excellent long-term heat-insulating properties and flame retardancy, and good appearance.

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Patent Owner(s)

Patent OwnerAddress
JSP CORPORATIONTOKYO 100-0005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHIKAWA, Tatsuyuki Utsunomiya-shi, JP 26 542
KOGURE, Naochika Utsunomiya-shi, JP 16 210
OKUDA, Akira Utsunomiya-shi, JP 24 202

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