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Country	kind	publication No.	Filing Date	Type	Sub-Type
EP	A1	EP2639314	Mar 14, 2012	Patent	Application
Type : Patent Sub-Type : Application
APPLICATION PUBLISHED WITH SEARCH REPORT		In vitro method for predicting whether a compound is genotoxic in vivo.		Sep 18, 2013

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
UNIVERSITEIT MAASTRICHT	MINDERBROEDERSBERG 4-6 6211 LK MAASTRICHT
ACADEMISCH ZIEKENHUIS MAASTRICHT	P DEBYELAAN 25 6229 HX MAASTRICHT

International Classification(s)

• C12Q:MEASURING OR TESTING PROCESSES INVOLVING ENZYMES O....

• 2013 Application Filing Year
• C12Q Class
• 2617 Applications Filed
• 2019 Patents Issued To-Date
• 77.15 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
LIZARRAGA-LOPEZ, Daneida	JG Maastricht, NL	1	1
# of filed Patents : 1 Total Citations : 1
Rieswijk, Linda	RP Maastricht, NL	1	1
# of filed Patents : 1 Total Citations : 1
Stephanus, Kleinjans Joseph Catharina	AR Maastricht, NL	1	1
# of filed Patents : 1 Total Citations : 1
Van, Delft Joseph Henri Marie	Etterbeek, BE	4	3
# of filed Patents : 4 Total Citations : 3

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Patent Citation Ranking

• 1 Citation Count
• C12Q Class

• 14.98 % this patent is cited more than
• 12 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 19, 2025

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0031,629

TEST BOARD FOR SEMICONDUCTOR PACKAGE, TEST SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

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Abstract

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A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

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Description

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Claims

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