CURABLE PROTECTANT FOR ELECTRONIC ASSEMBLIES
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United States of America Patent
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app pub date -
Apr 26, 2013
filing date -
May 16, 2006
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Abandoned
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Abstract
Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SO2CF3)2].
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