Substrate for Carrying Light Emitting Diodes and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Sep 19, 2013
app pub date -
May 11, 2012
filing date -
Mar 14, 2012
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Abandoned
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Abstract
A substrate for carrying light emitting diodes and a manufacturing method thereof are provided. The substrate includes a bottom portion, a side portion and a reflective element. The side portion is disposed on the bottom portion. An upper surface of the bottom portion and an inner surface of the side portion define a recess where the light emitting diodes and the reflective element are disposed. More specifically, the light emitting diodes are disposed on the upper surface, while the reflective element is disposed along the inner surface of the recess. With the above-mentioned arrangements, the light extraction efficiency of the light emitting diodes can be increased.
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