SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20130240897A1
SERIAL NO

13758078

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Abstract

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A semiconductor device includes a first semiconductor layer formed over a substrate; a second semiconductor layer formed over the first semiconductor layer; electrodes formed over the second semiconductor layer; and a third semiconductor layer formed on the second semiconductor layer; wherein the third semiconductor layer is formed so as to surround each element, in which the electrodes are formed, and wherein the third semiconductor layer is a semiconductor layer of a conductivity type whose polarity is opposite to that of carriers produced in the first semiconductor layer.

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Patent Owner(s)

Patent OwnerAddress
TRANSPHORM JAPAN INCSHIN-YOKOHAMA CENTER BLDG 9F 2-5-15 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA KANAGAWA 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IMADA, Tadahiro Kawasaki, JP 65 1181

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