Wire bonder including a transducer, a bond head, and a mounting apparatus
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United States of America Patent
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Dec 30, 2014
Issued Date -
N/A
app pub date -
Mar 15, 2012
filing date -
Mar 15, 2012
priority date (Note) -
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Abstract
Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.
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