3D-SHAPED COMPONENT WITH A CIRCUIT TRACE PATTERN AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Sep 19, 2013
app pub date -
Dec 11, 2012
filing date -
Mar 19, 2012
priority date (Note) -
Abandoned
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Abstract
A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.
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