SPLIT PUMPING METHOD, APPARATUS, AND SYSTEM
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United States of America Patent
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Issued Date -
Sep 12, 2013
app pub date -
Mar 1, 2013
filing date -
Mar 9, 2012
priority date (Note) -
Abandoned
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Abstract
A split-pumping system and method for semiconductor fabrication process chambers is provided. The split pumping method may provide two separate exhaust paths, each configured to evacuate a different process gas. The exhaust paths may be configured to not evacuate process gases other than the process gas that the exhaust path is configured to evacuate.
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