ASSEMBLED ELECTROMAGNETIC SHIELDING CASE
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United States of America Patent
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N/A
Issued Date -
Sep 12, 2013
app pub date -
May 7, 2012
filing date -
Mar 9, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element. Accordingly, with the assembled electromagnetic shielding case, not only is the electronic component insusceptible to electromagnetic interference and easy to change, but it is feasible to provide highly efficient heat dissipation and a miniaturized heat dissipation structure.
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