METHOD OF PRODUCING FILM SUBSTRATE

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United States of America Patent

SERIAL NO

13869379

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Abstract

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A method of producing a film substrate includes forming a sealing part for sealing a liquid crystal material between a first substrate and a second substrate into a shape having an outward projecting liquid crystal material injection port of the sealing part and cutting the first substrate and the second substrate into a shape having outward projecting parts opposite to the liquid crystal material injection port, in which the forming of the sealing part forms the liquid crystal material injection port of the sealing part on a cutting line of the cutting of the first substrate and the second substrate.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU FRONTECH LIMITEDINAGI-SHI TOKYO 206-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRANO, Takahiro Tokyo, JP 89 269

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