FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
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United States of America Patent
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Issued Date -
Sep 12, 2013
app pub date -
Mar 6, 2012
filing date -
Mar 6, 2012
priority date (Note) -
Abandoned
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Abstract
Embodiments of the present disclosure flip-chip packaging techniques and configurations. An apparatus may include a package substrate having a plurality of pads formed on the package substrate, the plurality of pads being configured to receive a corresponding plurality of interconnect structures formed on a die and a fluxing underfill material disposed on the package substrate, the fluxing underfill material comprising a fluxing agent configured to facilitate formation of solder bonds between individual interconnect structures of the plurality of interconnect structures and individual pads of the plurality of pads and an epoxy material configured to harden during formation of the solder bonds to mechanically strengthen the solder bonds. Other embodiments may also be described and/or claimed.
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