PHOTONIC FLEXIBLE INTERCONNECT
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United States of America Patent
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Issued Date -
Sep 5, 2013
app pub date -
Mar 5, 2012
filing date -
Mar 5, 2012
priority date (Note) -
Abandoned
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Abstract
Embodiments of the invention describe a silicon photonic interconnect, formed from an SOI substrate, having a waveguide for receiving optical data from an integrated circuit. Said photonic interconnect may comprise a flexible interconnect including a polymer layer disposed on the SOI substrate. Said photonic interconnect may include an optical fiber component to send/receive optical data to/from optical components or devices.
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