"CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME"
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United States of America Patent
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Issued Date -
Aug 29, 2013
app pub date -
Aug 11, 2011
filing date -
Sep 10, 2010
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Abstract
Provided is a chemical mechanical polishing pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several μm are formed.
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