MULTI-LAYER ARRAY TYPE LED DEVICE HAVING A MULTI-LAYER HEAT DISSIPATION STRUCTURE
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United States of America Patent
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Issued Date -
Aug 29, 2013
app pub date -
Feb 29, 2012
filing date -
Feb 29, 2012
priority date (Note) -
Abandoned
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Abstract
A multi-layer array type LED device having a multi-layer heat dissipation structure includes a heat dissipation seat, an optical module, a housing, a power supply module, a wireless transmission module, a diffusion cover and a lamp head. In the present invention, the heat-generating components include the optical module, the power supply module and the wireless transmission module, and the heat-generating components are separately installed so that the heat accumulation effect can be decreased. In the present invention, the heat dissipation seat is used together with the housing having a plurality of the heat dissipation holes. The heat dissipation seat having excellent heat conductivity is used for rapidly absorbing heat and transferring it to the surrounding environment, and the surrounding air can be introduced into the housing via the heat dissipation holes for further increasing the heat dissipation efficiency.
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