THERMALLY-CONDUCTIVE PASTE
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United States of America Patent
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Issued Date -
Aug 29, 2013
app pub date -
May 30, 2012
filing date -
Feb 29, 2012
priority date (Note) -
Abandoned
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Abstract
A thermally-conductive paste comprises a carrier, at least one graphene platelet, and a plurality of packing materials. The graphene platelets and the packing materials are dispersed in the carrier. At least a portion of the packing materials contact the surface of the graphene platelet. The graphene platelet has a very high thermal conductivity coefficient and a characteristic 2D structure and thus can provide continuous and long-distance thermal conduction paths for the thermally-conductive paste. Thereby is greatly improved the thermal conduction performance of the thermally-conductive paste.
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