ELECTRONIC CIRCUIT AND HEAT SINK
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United States of America Patent
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Issued Date -
Aug 29, 2013
app pub date -
Nov 11, 2011
filing date -
Nov 11, 2010
priority date (Note) -
Abandoned
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Abstract
An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.
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