PLASMA PROCESSING DEVICE

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United States of America Patent

APP PUB NO 20130220548A1
SERIAL NO

13821822

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Abstract

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A plasma processing device has: a metallic vacuum chamber; an antenna-placing section in which a radio-frequency antenna is placed inside a through-hole (hollow space) provided in an upper wall of the vacuum chamber; and a dielectric separating plate covering the entire inner surface of the upper wall. In this plasma processing device, the entire inner surface side of the upper wall is covered with the separating plate so that surfaces in different level otherwise formed when a smaller separating plate is used is not formed between the inner surface and the separating plate. Therefore, the generation of particles caused by the formation of adhered materials on the surfaces in different level is prevented.

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Patent Owner(s)

Patent OwnerAddress
EMD CORPORATIONSHIGA 520-2323

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ebe, Akinori Kyoto-shi, JP 31 119
Setsuhara, Yuichi Minoh-shi, JP 23 136

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