LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Aug 22, 2013
app pub date -
Oct 24, 2011
filing date -
Nov 5, 2010
priority date (Note) -
Abandoned
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Abstract
The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.
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