INTERFACE MODULE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 22, 2013
app pub date -
Nov 26, 2012
filing date -
Feb 16, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An interface module is provided. The interface module includes a substrate and a flexible print circuit board. The substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side. The flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.
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