SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Aug 22, 2013
app pub date -
Feb 16, 2012
filing date -
Feb 16, 2012
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Abstract
A semiconductor packaging method includes providing a substrate having a plurality of connection pads; mounting a chip on the substrate, wherein the chip comprises a plurality of copper-containing bumps directly coupled to the connection pads, and each of the copper-containing bumps comprises a ring surface; forming an anti-dissociation gel between the substrate and the chip, wherein the anti-dissociation gel comprises a plurality of anti-dissociation substances, and the ring surfaces of the copper-containing bumps are covered by the anti-dissociation substances.
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