METHOD FOR JOINING A FIRST ELECTRONIC COMPONENT AND A SECOND COMPONENT
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United States of America Patent
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Issued Date -
Aug 22, 2013
app pub date -
Feb 21, 2013
filing date -
Feb 22, 2012
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Abandoned
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Abstract
This invention relates to a method for joining a first electronic component with a second component using an active brazing alloy. It is the object of this invention to provide a simplified method for achieving a reliable, stress-reduced joint of a high-temperature stable piezoelectric oxidic mono-crystal. According to the method of the invention, a first component (1, 1a, 1b) and a second component (1, 2, 2a, 2b, 4, 4a) are provided, wherein the first component (1, 1a, 1b) includes a piezoelectric oxidic mono-crystal, wherein the piezoelectric oxidic mono-crystal of the first component (1), is joined with the second component (1, 2, 2a, 2b, 4, 4a) using an active brazing alloy (3), wherein the active brazing alloy (3) directly contacts the piezoelectric oxidic mono-crystal of the first component (1, 1a, 1b).
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