Process for Electroless Deposition of Metals Using Highly Alkaline Plating Bath
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United States of America Patent
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Issued Date -
Aug 15, 2013
app pub date -
Oct 12, 2011
filing date -
Oct 13, 2010
priority date (Note) -
Abandoned
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Abstract
A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5.
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