SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY
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United States of America Patent
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Issued Date -
Aug 15, 2013
app pub date -
Feb 14, 2013
filing date -
Feb 14, 2012
priority date (Note) -
Abandoned
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Abstract
A circuit comprising an integrated circuit disposed on a substrate. A via disposed adjacent to the integrated circuit. A solid metallic pin disposed within the via and configured to conduct heat generated by the integrated circuit to a heat sink.
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