Methods and Systems For Removing Contaminants From A Wire Of A Saw
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United States of America Patent
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Issued Date -
Aug 15, 2013
app pub date -
Aug 14, 2012
filing date -
Aug 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system for ultrasonically cleaning one or more wires of a wire saw for slicing semiconductor or solar material into wafers. The system includes an ultrasonic transducer connected to a sonotrode. The system also includes a sonotrode plate adjacent to one or more of the wires. The sonotrode plate has an opening that exposes the sonotrode to one or more of the wires. The system further includes a tank for delivering a flow of liquid to contact the sonotrode and one or more of the wires. The tank is positioned on the same side of the wires as the sonotrode plate. The ultrasonic transducer is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires.
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