COLORING/GROUPING PATTERNS FOR MULTI-PATTERNING
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United States of America Patent
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N/A
Issued Date -
Aug 8, 2013
app pub date -
Feb 3, 2012
filing date -
Feb 3, 2012
priority date (Note) -
Abandoned
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Abstract
A method comprises: accessing a persistent, machine readable storage medium containing data representing an integrated circuit (IC) design to be fabricated using multi-patterning; identifying at least one network of conductive patterns configured to transmit signals that substantially impact timing of at least one circuit in the IC; pre-grouping the at least one network of conductive patterns in a first group; and electronically providing data to an electronic design automation (EDA) tool to cause inclusion in a first single photomask of all portions of the patterns within the first group that are to be formed in a single layer of the IC, wherein the single layer is to be multi-patterned using at least two photomasks.
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