METAL FILM DEPOSITION

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United States of America Patent

APP PUB NO 20130202794A1
SERIAL NO

13811472

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed are modified Atomic Layer Deposition processes used to deposit metal films on a substrate.

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Patent Owner(s)

Patent OwnerAddress
AMERICAN AIR LIQUIDE INC46409 LANDING PARKWAY FREMONT CA 94538

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dussarrat, Christian Tokyo, JP 139 7373
Omarjee, Vincent M Grenoble, FR 29 485

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