METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAME
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United States of America Patent
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Issued Date -
Aug 8, 2013
app pub date -
Nov 27, 2012
filing date -
Feb 3, 2012
priority date (Note) -
Abandoned
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Abstract
The epoxy bleed out prevention method including: providing a lead frame that is manufactured through a shaping process which forms a die pad and a plurality of leads by using a conductive raw material, a pre-plating process performed on the shaped conductive raw material, and a tape attaching process; and performing a bleed out prevention process which prevents an epoxy bleed out of a die bonding epoxy-based resin applied on the die pad after the tape attaching process.
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