PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING
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United States of America Patent
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Issued Date -
Aug 8, 2013
app pub date -
Jul 31, 2012
filing date -
Feb 8, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package includes a semiconductor die having an upper surface with bond pads thereon. A plurality of leads surround sides of the semiconductor die. Bonding wires couple each of the bond pads to a corresponding one of the plurality of leads. An encapsulant covers the upper surface and the sides of the semiconductor die and the bonding wires. The encapsulant also covers a portion of a top of each of the plurality of leads and sides of the plurality of leads that are nearest the semiconductor die. A bottom of each of the plurality of leads and the sides of the plurality of leads that are farthest from the semiconductor die are exposed outside the encapsulant. A protective film covers a lower surface of the semiconductor die and has a bottom that is substantially coextensive with the bottom of each of the plurality of leads.
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