COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY
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United States of America Patent
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Issued Date -
Aug 8, 2013
app pub date -
Oct 21, 2011
filing date -
Oct 26, 2010
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Abandoned
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Abstract
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).
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