Wafer bonding chamber with dissimilar wafer temperatures
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United States of America Patent
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Issued Date -
Aug 8, 2013
app pub date -
Feb 8, 2012
filing date -
Feb 8, 2012
priority date (Note) -
Abandoned
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Abstract
A wafer bonding chamber is disclosed, which maintains two wafers to be bonded together at two substantially different temperatures. A lid wafer may be held at a higher temperature than a device wafer, as the device wafer may have delicate structures formed thereon, which cannot withstand higher temperatures. The lid wafer may have an adhesive bonding material formed thereon, which is melted or cured at the higher temperature. The temperature differential may be maintained by applying at least one of a heating mechanism and a cooling mechanism preferentially to one of the wafers to be bonded in the wafer bonding chamber.
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