SUBSTRATE INSPECTION METHOD
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United States of America Patent
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N/A
Issued Date -
Aug 1, 2013
app pub date -
Oct 13, 2011
filing date -
Oct 14, 2010
priority date (Note) -
Abandoned
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Abstract
A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object.
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