METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER

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United States of America Patent

APP PUB NO 20130192885A1
SERIAL NO

13756942

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Abstract

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Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.

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Patent Owner(s)

Patent OwnerAddress
MDS CO LTD84 JEONGDONG-RO SEONGSAN-GU GYEONGSANGNAM-DO CHANGWON-SI 641-120

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KWON, Soon-Chul Changwon-city, KR 5 12
LEE, Sang-Min Changwon-city, KR 249 5049

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