METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER

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United States of America Patent

APP PUB NO 20130192885A1
SERIAL NO

13756942

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.

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Patent Owner(s)

Patent OwnerAddress
MDS CO LTD84 JEONGDONG-RO SEONGSAN-GU GYEONGSANGNAM-DO CHANGWON-SI 641-120

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KWON, Soon-Chul Changwon-city, KR 5 12
LEE, Sang-Min Changwon-city, KR 249 5049

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  • 3 Citation Count
  • H05K Class
  • 2.95 % this patent is cited more than
  • 12 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges37564307136725726137952001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500525550575600

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