WAFER CUTTING METHOD AND DEVICE
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United States of America Patent
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Issued Date -
Aug 1, 2013
app pub date -
Jan 30, 2013
filing date -
Jan 31, 2012
priority date (Note) -
Abandoned
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Abstract
A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.
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