METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20130183820A1
SERIAL NO

13705930

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Abstract

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A silicon carbide layer is thermally etched by supplying the silicon carbide layer with a process gas that can chemically react with silicon carbide, while heating the silicon carbide layer. With this thermal etching, a carbon film is formed on the silicon carbide layer. Heat treatment is provided to the silicon carbide layer to diffuse carbon from the carbon film into the silicon carbide layer.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041
NATIONAL UNIVERSITY CORPORATION NARA INSTITUTE OF SCIENCE AND TECHNOLOGYIKOMA-SHI NARA 630-0192

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatayama, Tomoaki Ikoma-shi, JP 10 76
Hiyoshi, Toru Osaka-shi, JP 122 647
Masuda, Takeyoshi Osaka-shi, JP 168 907

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