METHOD FOR FORMING SEALED ELECTRICAL FEEDTHROUGHS THROUGH AN ENCAPSULATION PACKAGE AND ENCAPSULATION PACKAGE PROVIDED WITH AT LEAST ONE SUCH ELECTRICAL FEEDTHROUGH
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United States of America Patent
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Issued Date -
Jul 18, 2013
app pub date -
Jan 16, 2013
filing date -
Jan 17, 2012
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Abandoned
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Abstract
A method for forming sealed electrical feedthroughs through an encapsulation package, especially for an electronic, optical, or optoelectronic component, including forming a through opening in one of the package walls, and advantageously the bottom of said package; and soldering on this opening, a plate made of cofired ceramic having the electric connections transiting therethrough.
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