Heat-Seal System and Method
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United States of America Patent
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app pub date -
Mar 8, 2013
filing date -
Jan 8, 2010
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Abandoned
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Abstract
A heat-seal device generally includes a heat source, a thermal conductor, which encapsulates at least a portion of the heat source and is capable of transferring heat from the heat source, and a thermal insulator, which substantially surrounds the thermal conductor but leaves a portion thereof exposed, the exposed portion of the thermal conductor providing a heat-seal contact surface, which is adapted to be brought into sliding contact with a material to be sealed.
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