ETCHING SOLUTION AND METHOD OF MANUFACTURING PRINTED WIRING SUBSTRATE USING THE SAME
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United States of America Patent
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Issued Date -
Jul 11, 2013
app pub date -
May 17, 2012
filing date -
Jan 6, 2012
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Abstract
This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.
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