COMPOSITION FOR WATER-REPELLENT TREATMENT OF SURFACE, AND METHOD FOR WATER-REPELLENT TREATMENT OF SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAME

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United States of America Patent

APP PUB NO 20130171835A1
SERIAL NO

13821815

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Abstract

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The purpose of the present invention to provide: a composition which can be used for water-repellent treating of the entire surface of a semiconductor substrate having a pattern formed by laminating a Si-containing insulating layer and a metal layer, at one time; and a method for water-repellent treatment of the semiconductor substrate surface using the composition.

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Patent Owner(s)

Patent OwnerAddress
WAKO PURE CHEMICAL INDUSTRIES LTD1-2 DOSHOMACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 540-8605

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kakizawa, Masahiko Saitama, JP 20 497
Mizuta, Hironori Saitama, JP 17 133
Urano, Yoji Saitama, JP 14 166

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